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Substrate and Chip Packaging Laser Processing Series

HDZ-MDP200

Machine Features

1 High-speed visual scanning system; NG identification and positioning recognizable

2.Double platform feeding system design, effectively improved processing efficiency

3.Supporting singlesided and doublesided marking

4.Communication with customers’ MES data to obtain and return information

Applications

Applicable to marking of NG units or gold spots on PCB boards

Technical Data Sheet

Machines model	HDZ-MDP200
Laser wavelength	Green laser (532 nm)
Processing product dimension	50mm40mm-300mm120mm
Final processing repeated positioning precision	±0.05mm
Support file format	dxf，plt
Power supply	AC/220V, 50/60Hz
Cooling mode	Air cooling / Water cooling
Air supply	0.6-0.8MPa
Overall dimensions	1850mm1960mm1990mm

Cookies Consent

Han's Laser Solutions

Substrate and Chip Packaging Laser Processing Series

HDZ-MDP200

Applications

Laser Marking Effects

Recommended Products

HDZ-PCB100F

HDZ-SIC200

HDZ-WAF600

HDZ-PCB6565AL

HDZ-FPC4530D

Double-sided PCBA laser marking

HDZ-8221

HDZ-9222

HDZ-9121