Products Laser Marking Equipment PCBA & IC & Wafer Laser Marking Machine
HDZ-SIC200

Automatic IC Laser Marking Machine

HDZ-SIC200

Machine Features

1. Fully-automatic loading/unloading from hanging basket to hanging basket, stable laser output, direction inspection function of intelligent vision system, marking effect sampling inspection function

2. Friendly HMI

3. Double-head 20W fiber laser marking system; optional laser sources including green laser, UV laser, CO2 laser and more

4. Special fume and dust removal device during marking, keeping the marking area environment clean

5. Compliant with CE MARK and SEMI standard

Applications

Applicable to the packaged IC marking of DIP, QFN and BGA

Technical Data Sheet

Machine Model

HDZ-SIC100

HDZ-SIC200

Marking Scope

320mm*160mm

320mm*160mm

Product Specification

L: 160-320mm; W: 30-80mm

L: 160-320mm; W: 30-80mm

Font

TFT and SHX; with font library module modification program

Final Processing Repeated Positioning Precision

±0.1mm

±0.1mm

UPH

1200 pieces/h (idle)

1200 pieces/h (idle)

Power Supply

AC 220V, 50/60Hz

AC 220V, 50/60Hz

Air Source

0.6-0.8 MPa

0.6-0.8 MPa

Overall Dimension

2525mm*1665mm*2000mm

2515mm*1420mm*2000mm


Laser Marking Effects

IC marking
IC marking
IC marking
IC marking
IC marking
IC marking
IC marking
IC marking

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