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Automatic IC Laser Marking Machine

HDZ-SIC200

Machine Features

1. Fully-automatic loading/unloading from hanging basket to hanging basket, stable laser output, direction inspection function of intelligent vision system, marking effect sampling inspection function

2. Friendly HMI

3. Double-head 20W fiber laser marking system; optional laser sources including green laser, UV laser, CO2 laser and more

4. Special fume and dust removal device during marking, keeping the marking area environment clean

5. Compliant with CE MARK and SEMI standard

Applications

Applicable to the packaged IC marking of DIP, QFN and BGA

Technical Data Sheet

Machine Model	HDZ-SIC100	HDZ-SIC200
Marking Scope	320mm*160mm	320mm*160mm
Product Specification	L: 160-320mm; W: 30-80mm	L: 160-320mm; W: 30-80mm
Font	TFT and SHX; with font library module modification program
Final Processing Repeated Positioning Precision	±0.1mm	±0.1mm
UPH	1200 pieces/h (idle)	1200 pieces/h (idle)
Power Supply	AC 220V, 50/60Hz	AC 220V, 50/60Hz
Air Source	0.6-0.8 MPa	0.6-0.8 MPa
Overall Dimension	2525mm1665mm2000mm	2515mm1420mm2000mm

Laser Marking Effects

IC marking

Cookies Consent

Han's Laser Solutions

Automatic IC Laser Marking Machine

HDZ-SIC200

Applications

Laser Marking Effects

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