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Fully Automatic Wafer Laser Marking Machine

HDZ-WAF600

Machine Features

1. Green laser or UV laser, fine focusing spot is, non-contact marking

2. Fully-automatic loading and unloading, automatic edge searching, simple operation and high efficiency

3. Computer control system, Windows operation platform，interface in English, self-developed software, easy to operate.

4. High automation, automatic fault alarm function

5. Precise marking to the product DIE.

Applications

Applicable to the 6-inch, 8-inch and 12-inch wafer marking

Technical Data Sheet

Machine Model	HDZ-WAF500	HDZ-WAF600
Laser Type	Fiber laser, CO2 (optional)	UV, green light (optional)
Laser Power (customized according to the customer’s actual marking need)	Fiber 20W、CO2 10W	UV 7W, green light 10W
Cooling Mode	Air cooling	Water cooling
Final Processing Repeated Positioning Precision	±0.2mm	±0.05mm
Processing Product Type	2 inch, 4 inch, 6 inch wafer	6 inch, 8 inch, 12 inch wafer
Power Supply	220V, 50Hz	220V, 50Hz
Overall Dimension (for Reference)	900mm1150mm1700mm	1950mm1650mm1635mm

Laser Marking Effects

Wafer marking

Dot matrix character marking

Wafer marking

Cookies Consent

Han's Laser Solutions

Fully Automatic Wafer Laser Marking Machine

HDZ-WAF600

Applications

Laser Marking Effects

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