Products Laser Marking Equipment PCBA & IC & Wafer Laser Marking Machine
HDZ-8221

Automatic Chip Packaging and Marking Machine

HDZ-8221

Machine Features

1. Efficient dual-laser marking

2.Integrated pre-marking and postmarking inspection systems ensuring marking quality

3. Supporting the SECS/GEM communication protocol

4. Customizable automation modules per customer processing requirements

5. Suitable for packaging of lead frames such as DIP, QFN and SSOP

Technical Data Sheet

Machines model  

HDZ-8221

Laser Type

UV, green and infrared laser sources 355nm、532nm、1064nm

Marking area

300mm*150mm

Marking Product Dimensions

Length：160-320mm， Width：60-100mm

Final processing repeated positioning precision   

±0.05mm

file format supported

dxf，plt

Power supply

AC/220V, 50/60Hz

Cooling mode

Air cooling / Water cooling

Air supply

0.6-0.8MPa

Overall dimensions

2000mm*1200mm*1850mm 


Laser Marking Effects

Recommended Products

HDZ-PCB100F

HDZ-SIC200

HDZ-WAF600

HDZ-PCB6565AL

HDZ-FPC4530D

Double-sided PCBA laser marking

HDZ-MDP200

HDZ-9222

HDZ-9121
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