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Automatic Wafer DIE Laser Marking Machine

HDZ-9121

Machine Features

1. Compatible with wafer forward beating, reverse beating process,bare chip and permeable film marking process.

2.Automatic operation, equipped with double arm manipulator to improve product processing efficiency.

3. Power detection system to ensure the consistency of processing effect

Technical Data Sheet

Machines model	HDZ-9121
Laser wavelength	UV and green laser sources 355nm, 532nm
Minimum word height	0.15mm
Cooling mode	Water cooling
Final processing repeated positioning precision	±0.05mm
Processing product type	12-inch and less wafer
Support file formal	dxf、plt
SECS/GEM	Support（Optional）
Supply Voltage	AC/220V/50Hz
Air supply	0.6-0.8MPa
Overall dimensions	2500mm1900mm2200mm

Cookies Consent

Han's Laser Solutions

Automatic Wafer DIE Laser Marking Machine

HDZ-9121

Laser Marking Effects

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