Products Laser Marking Equipment PCBA & IC & Wafer Laser Marking Machine
HDZ-9121

Automatic Wafer DIE Laser Marking Machine

HDZ-9121

Machine Features

1. Compatible with wafer forward beating, reverse beating process,bare chip and permeable film marking process.

2.Automatic operation, equipped with double arm manipulator to improve product processing efficiency.

3. Power detection system to ensure the consistency of processing effect

Technical Data Sheet

Machines model  

HDZ-9121

Laser wavelength                                            

UV and green laser sources

 355nm, 532nm

Minimum word height                                                                                                    

  0.15mm

Cooling mode                                                  

Water cooling

Final processing repeated positioning precision            

  ±0.05mm

Processing product type                                    

 12-inch and less wafer

Support file formal                                              

 dxf、plt

SECS/GEM                                                                                                     

Support（Optional）

Supply Voltage                                                       

   AC/220V/50Hz

Air supply

0.6-0.8MPa

Overall dimensions                                                                                             

  2500mm*1900mm*2200mm


Laser Marking Effects

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