

1. Glass thickness: 0.2-0.5mm
2. Chipping size: <0.02mm
3. Processing efficiency: 6S/hole
4. Non-contact processing with minimal material damage and high cutting precision
5. Short single-point laser action time with a small heat-affected zone
6. High efficiency achieved through high-speed drilling with a linear motor and galvanometer mirror
Protective lens for camera
| Processing Range | 400*250mm |
| Platform Repeated Positioning Accuracy | ±2um |
| Platform Dynamic Positioning Accuracy | ±3um |
| Maximum Platform Moving Speed | 1000mm/s |
| Camera Positioning Accuracy | ±0.01mm |
| Overall Weight | ≤3T |
| Drilling Thickness | 0.5mm |
| Chipping | ≤10um |
| Laser Type | Infrared Picosecond |
| Wavelength | 1064nm |
| Power | 30W |
| Pulse Width | <10ps |
| Cooling Method | Water Cooling |
| Power Requirement | 380V/50Hz AC 3P |