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Fully Automatic Sapphire Cutting and Cracking Machine

Machine Features

1. Sapphire thickness: 0.2-0.6mm

2. Chipping size: ＜0.01mm

3. Processing efficiency: 2 seconds/piece, φ11.76, T0.3mm

4. Non-contact processing with minimal material damage and high cutting precision

5. Short laser single-point time, small heat-affected zone, and no glass debris generated

6. High-speed cutting with linear motor for efficient operation

Applications

Can be applied in home button, side button cover plate, camera protective lens

Technical Data Sheet

Machine	Fully Automatic Sapphire Cutting and Cracking Machine
Processing Range	80*80mm (Fully Automatic)
Positioning Repetition Accuracy of Platform	±1um
Dynamic Positioning Accuracy of Platform	±3um
Maximum Moving Speed of Platform	200mm/s
Camera Positioning Accuracy	±0.01mm
Weight of Machine	≤3.5T
Cutting Thickness	0.3mm (Single Blade) for Sapphire
Chipping Edge	≤10um
Laser Type	Infrared Picosecond
Wavelength	1030nm
Power	10W
Pulse Width	＜10ps
Cooling Method	Water Cooling
Power Requirement	380V/50Hz AC 3P

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Han's Laser Solutions

Fully Automatic Sapphire Cutting and Cracking Machine

Applications

Laser Cutting Effects

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