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Fully Automatic Sapphire Cutting and Cracking Machine

Machine Features

1. Sapphire thickness: 0.2-0.6mm

2. Chipping size: ＜0.01mm

3. Processing efficiency: 2 seconds/piece, φ11.76, T0.3mm

4. Non-contact processing with minimal material damage and high cutting precision

5. Short laser single-point time, small heat-affected zone, and no glass debris generated

6. High-speed cutting with linear motor for efficient operation


Applications

Can be applied in home button, side button cover plate, camera protective lens

Technical Data Sheet
MachineFully Automatic Sapphire Cutting and Cracking Machine

Processing Range

80*80mm (Fully Automatic)

Positioning Repetition Accuracy of Platform

±1um

Dynamic Positioning Accuracy of Platform

±3um

Maximum Moving Speed of Platform

 200mm/s

Camera Positioning Accuracy

±0.01mm

Weight of Machine

≤3.5T

Cutting Thickness

 0.3mm (Single Blade) for Sapphire

Chipping Edge

≤10um

Laser Type  

Infrared Picosecond

Wavelength  

 1030nm

Power

10W

Pulse Width

＜10ps

Cooling Method

Water Cooling

Power Requirement

380V/50Hz AC 3P


Laser Cutting Effects

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Contact Us
Sales Hotline
+86-400-666-4000