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HDZ-GCF3000

Ultrafast Glass Cutting and Drilling Machine

HDZ-GCF3000

Machine Features

1.Glass thickness: 0.1-1.2mm

2.Edge breakage size: ＜0.005mm

3.Processing speed: 4s/pcs, 115*60mm, R5mm, DOL<50µm, T=0.7mm Corning

4.Non-contact processing, little damage to the material, high cutting precision

5.Layering 3d cutting, used for cutting non-tempered glass and tempered glass

6.The action time of single laser spot is short, the heat-affect- ed zone is small, and no broken glasses are produced.

7.It can be used with linear motor together to cut in a high speed and high efficiency


Applications

Applicable to the high-speed specially-shaped cutting of glass and sapphire with DOL<50µm, cover plate glass of mobile phone, protective lens of camera, cover plate of Home key, and optical lens.

Technical Data Sheet
   Machine ModelHDZ-GCF3000

Processing scope

150X150mm（Automatic）；
300X250mm（Manual）

Platform repeated positioning precision

±1μm

 Platform dynamic positioning precision

±3μm

 Max. moving speed of platform

1000mm/s

 CCD positioning precision

±0.01mm

 Machine weight

≤3.5T

 Cutting thickness

0.7mm（once）

 Edge breakage value

≤10μm

 Laser type

Infrared picosecond

 Wavelength

1064nm

Power

20W

Pulse width

<10ps

Cooling mode

Water cooling

Laser power supply

380V, 3PH, 8kW


Laser Cutting Effects

Sapphire camera cutting
Sapphire camera cutting
TFT Notch cutting
TFT Notch cutting
Camera glass cover cutting
Camera glass cover cutting
0.7mm glass drilling φ2.0mm
0.7mm glass drilling φ2.0mm

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Contact Us
Sales Hotline
+86-400-666-4000