Products Laser Cutting Equipment Brittle Material Precision Laser Cutting Equipment

Fully Automatic Cutting and Cracking Machine

Machine Features

1. Ultra-thin Glass Thickness: 0.03-0.1mm

2. Chipping Size:＜0.01mm

3. Processing Efficiency:

95S/PCS (when glass is divided into 6 pieces, size 8 inches)

60S/PCS (when glass is divided into 4 pieces, size 10 inches)

4. Non-contact processing with minimal material damage and high cutting accuracy

5. Short laser single-point work time, small heat-affected zone, and no glass debris produced

6. High-speed cutting with linear motors for high efficiency


Applications

Flexible Screen Cover Plate

Technical Data Sheet
MachineFully Automatic Cutting and Cracking Machine
Processing Range250*200mm (Fully Automatic)
Positioning Repetition Accuracy of Platform±1um
Dynamic Positioning Accuracy of Platform±3um
Maximum Moving Speed of Platform200mm/s
Camera Positioning Accuracy±0.01mm
Weight of Machine≤4.5T
Cutting Thickness0.1mm (Single Blade)
Chipping Edge≤10um
Laser TypeInfrared Picosecond
Wavelength1030nm
Power50W
Pulse Width0.3-10ps
Cooling MethodWater Cooling
Power Requirement380V/50Hz AC 3P


Laser Cutting Effects

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+86-400-666-4000