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1.Glass thickness: 0.1-1.2mm
2.Edge breakage size: <0.005mm
3.Processing speed: 4s/pcs, 115*60mm, R5mm, DOL<50µm, T=0.7mm Corning
4.Non-contact processing, little damage to the material, high cutting precision
5.Layering 3d cutting, used for cutting non-tempered glass and tempered glass
6.The action time of single laser spot is short, the heat-affect- ed zone is small, and no broken glasses are produced.
7.It can be used with linear motor together to cut in a high speed and high efficiency
Applicable to the high-speed specially-shaped cutting of glass and sapphire with DOL<50µm, cover plate glass of mobile phone, protective lens of camera, cover plate of Home key, and optical lens.
| Machine Model | HDZ-GCF3000 |
Processing scope | 150X150mm(Automatic); |
Platform repeated positioning precision | ±1μm |
Platform dynamic positioning precision | ±3μm |
Max. moving speed of platform | 1000mm/s |
CCD positioning precision | ±0.01mm |
Machine weight | ≤3.5T |
Cutting thickness | 0.7mm(once) |
Edge breakage value | ≤10μm |
Laser type | Infrared picosecond |
Wavelength | 1064nm |
Power | 20W |
Pulse width | <10ps |
Cooling mode | Water cooling |
Laser power supply | 380V, 3PH, 8kW |