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1. Non-contact processing with minimal material damage and high precision.
2. The equipment features a user-friendly interface, easy operation, and convenient maintenance.
3. Marble linear motor platform ensures high stability.
4. Utilizes femtosecond laser technology for efficient and high-quality processing.
5. Independently developed processing and control system.
6. Equipped with a high-precision automatic calibration system.
Processing of through-holes in glass substrates
| Processing Range | 730mm x 920mm |
| Platform Repeated Positioning Accuracy | ±1um |
| Platform Dynamic Positioning Accuracy | ±3um |
| Maximum Platform Moving Speed | 200mm/s |
| Camera Positioning Accuracy | ±0.005mm |
| Overall Weight of the Machine | ≤3.5T |
| Laser Type | Infrared Femtosecond |
| Wavelength | 1030nm |
| Power | 20W |
| Pulse Width | <10ps |
| Cooling Method | Water Cooling |
| Power Requirement | 380V/50Hz AC 3P |