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1. Precision laser cutting device specifically designed for cutting three-dimensional components with complex curved surfaces
2. Extremely high flexibility and stability, meeting the diverse needs of various industries and fields, featuring a marble base, equipped with an infrared laser for cutting and a CO2 laser for chipping
3. Combined with a multi-axis synchronous control method, realizing linear motion along the XYZ axes and rotational motion along the AC/BC axes, significantly enhancing product utilization
4. Self-developed visual positioning system algorithm, strong compatibility and high equipment stability
5. Customizable design options, enabling automated production for processing complex curved surfaces.
| Processing Range | Curved Glass, Spherical Surfaces, Freeform Surfaces |
| Platform Repeated Positioning Accuracy | ±1um |
| Platform Dynamic Positioning Accuracy | ±3um |
| Maximum Platform Moving Speed | 150mm/s |
| Camera Positioning Accuracy | ±0.01mm |
| Machine Weight | ≤9T |
| Laser Type | Infrared Picosecond |
| Wavelength | 1064nm |
| Power | 50W |
| Pulse Width | <10ps |
| Cooling Method | Water Cooling |
| Power Requirement | 380V/50Hz AC 3P |