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Wafer Laser Cutting Machine

HDZ-WUVC100

Machine Features

1. 355nm UV laser, long-time stable performance, good light spot

2. Reliable and high-precision X-Y-Z-θ worktable, excellent accelerating and decelerating performance, improved productivity

3. Wafer fixation via vacuum absorption during platform movement

4. Wafer positioning via wafer markpoint positioning for cutting precision assurance

5. High-efficient and flexible software operation system with simple-concise interface

6. Automatic loading/unloading, robot carrying and automatic edge searching

Applications

Applicable to 2 inch, 4 inch, 8 inch and 12 inch wafer cutting

Technical Data Sheet

Machine model	HDZ-WUVC100	HDZ-WUVC200
Laser power	15W	15W
Laser wavelength	355nm	355nm
XY axis repeated positioning precision	±1µm	±1µm
θ axis repeated positioning precision	±15s	±15s
Cutting line width	>15µm	>15µm
Cutting depth	>25µm	>25µm
Cutting speed (*The cutting speed varies from different products)	100mm/s	100mm/s
Loading and unloading mode	Manual	Robot carrying; automatic edge searching
Processing product type	2 inch-12 inch wafers	2 inch-12 inch wafers
Supply Voltage, Electricity Demand	AC 220V，50Hz	AC 220V，50Hz

Laser Cutting Effects

Wafer cutting sample

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Han's Laser Solutions

Wafer Laser Cutting Machine

HDZ-WUVC100

Applications

Laser Cutting Effects

Recommended Products

HDZ-UVC3030

HDZ-CL4030

HDZ-UVC3040D

HDZ-CCM200