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1. Self-developed high-performance UV laser generator wiht very small heat-affected zone, enabling more efficient processing of high-density, highly integrated PCBA products.
2. High-precision motion system with high-precision scanning galvanometers and vision positioning system assuring cutting accuracy
3. Self-developed control software with multi‑jointed panel cutting, automatic focusing, distortion compensation and other functions to meet diverse cutting requirements of complex products.
1. Suitable for precision cutting, half‑cutting and grooving of materials such as FPCBA, PCBA, RF materials, CVL and SIP 2. Suitable for the high-quality cutting of Coverlay, PI, FR4, FR5 and CEM materials 3. Suitable for the precise processing of electronic industry such as mobile phone fingerprint module, camera module, integrated circuit chips.
Equipment Model | HDZ-UVC3030/HDZ-UVC3030B |
Laser Generator | UV (Green nanosecond or UV picosecond) |
Laser Power | 20-60W |
Minimum Line Width | 0.03mm |
Repeat Positioning Accuracy | ±0.02mm / ±0.05mm |
Maximun Processing Area | 300mm*300mm |
Positioning System | Visual Camera Positioning |
Cooling Method | Water-Cooling |
Dimensions | 1000mm*1100mm*1750mm |