

1.Single-station integrated design with compact structure, flexible and convenient
2.Fast solder ball spraying
3.Stable and reliable solder ball distribution
4.Contact‑free, no residue after welding
5.Small thermal impact and high welding yield
6. Easy and convenient maintenance
Welding in 3C electronics industry, especially for wearable devices such as TWS headsets, watches, VCM, CCM, chip BGA packaging and more.
Solder Ball System | Solder Ball Diameter | 0.15mm-0.6mm | Other diameters are customizable |
Spraying Speed | 3-5balls/s | ||
Nozzle Life | 200,000-400,000 times | ||
Welding Yield | Above 99% | ||
Motion Section | Repeated Positioning Accuracy | ±0.01mm | |
Welding Range | 200mm*200mm | Customizable | |
CCD Positioning CCD | 5 M pixels | ||
System Structure | Dimensions | 980mm*1000mm*1900mm | |
Total Weight | 450KG | ||
Supply Voltage, Electricity Demand | AC220V,15A,50Hz |