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Single-Station Solder Ball Soldering System

Machine Features

1.Single-station integrated design with compact structure, flexible and convenient

2.Fast solder ball spraying

3.Stable and reliable solder ball distribution

4.Contact‑free, no residue after welding

5.Small thermal impact and high welding yield

6. Easy and convenient maintenance

Applications

Welding in 3C electronics industry, especially for wearable devices such as TWS headsets, watches, VCM, CCM, chip BGA packaging and more.

Brief Description

High integration with a compact structure, the system features a lightweight design, high efficiency and stable solderball jetting speed, enabling flexible layout for production and experimental testing.

Technical Data Sheet

Solder Ball System	Solder Ball Diameter	0.15mm-0.6mm	Other diameters are customizable
	Spraying Speed	3-5balls/s
	Nozzle Life	200,000-400,000 times
	Welding Yield	Above 99%
Motion Section	Repeated Positioning Accuracy	±0.01mm
	Welding Range	200mm*200mm	Customizable
	CCD Positioning CCD	5 M pixels
System Structure	Dimensions	980mm1000mm1900mm
	Total Weight	450KG
	Supply Voltage, Electricity Demand	AC220V,15A,50Hz

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Han's Laser Solutions

Single-Station Solder Ball Soldering System

Applications

Brief Description

Laser Welding Effects

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