2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
1. With high-performance UV laser, the laser cutting heat-affected zone is small and it can more efficiently process the high-density and highly integrated PCBA product
2. The self-developed control software has functions of multiple jointed board cutting, automatic focusing and distortion compensation to achieve high-precision processing
3. With the high-precision motion platform system and high-precision galvanometer scanner, the cutting precision is high
4. The high-precision CCD positioning system can ensure the product’s processing precision.
1. Suitable for precision cutting, half cutting, trenching of materials such as FPCBA, PCBA, RF, CVL and SIP
2. Applicable for the high-quality cutting of coverlay, PI, FR4, FR5 and CEM materials
3. Applicable for the precise processing of electronic industry like mobile phone fingerprint module, camera module, integrated chip.
|Control system||(imported from Germany) square head + control card, Windows 7|
|Final processing repeated positioning precision||±0.02mm|
|Max. processing area||300mm*300mm|
|Camera positioning system||5MP|
|Support file format||Dxf, plt and so on|
|Overall dimension (for reference)||1060*1000*1850mm|
|Power supply||220V, 50Hz, 6kW|
|Min. line width||0.03mm|
|Cooling mode||Water cooling|
|Repeated positioning precision||±0.002mm|