HDZ-SIC200
Brief Description
Applicable for the packaged IC marking of DIP, QFN and BGA.
Categories
PCBA & IC & Wafer marking
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Features:
1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser output, direction inspection function of intelligent vision system, sampling inspection function of marking effect
2. Friendly HMI
3. Imported double-head 20W fiber laser marking system; the green laser, UV laser, CO2 laser and other laser sources are optional
4. With special fume removal device, it can quickly extract the fume and dust produced during marking to protect the marking area environment
5. It complies with CE MARK and SEMI standard
2. Friendly HMI
3. Imported double-head 20W fiber laser marking system; the green laser, UV laser, CO2 laser and other laser sources are optional
4. With special fume removal device, it can quickly extract the fume and dust produced during marking to protect the marking area environment
5. It complies with CE MARK and SEMI standard
Specification:
| Machine model | HDZ-SIC100 | HDZ-SIC200 |
| Marking scope | 320mm*160mm | 320mm*160mm |
| Product specification | L: 160-320mm; W: 30-80mm | L: 160-320mm; W: 30-80mm |
| Font | TFT and SHX; with font library module modification program | |
| Final processing repeated positioning precision | ±0.1mm | ±0.1mm |
| UPH | 1200 pieces/h (idle) | 1200 pieces/h (idle) |
| Power supply | AC 220V, 50/60Hz | AC 220V, 50/60Hz |
| Air source | 0.6-0.8 MPa | 0.6-0.8 MPa |
| Overall dimension | 2525mm*1665mm*2000mm | 2515mm*1420mm*2000mm |
Sample
IC marking
IC marking
IC marking
IC marking
