1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
Features:
1. Applicable to a wide range of materials.
2. Good beam quality, small focused laser spot, enabling super-fine marking.
3. Small heat-affected zone, avoiding damaging the material; high yield rate.
4. High marking speed, high efficiency and high precision.
5. No consumables are required, thereby reducing cost and maintenance expenses.
6. Overall performance is stable, suitable for continuous long-time operation.
7. Rotary worktable is used for marking.
2. Good beam quality, small focused laser spot, enabling super-fine marking.
3. Small heat-affected zone, avoiding damaging the material; high yield rate.
4. High marking speed, high efficiency and high precision.
5. No consumables are required, thereby reducing cost and maintenance expenses.
6. Overall performance is stable, suitable for continuous long-time operation.
7. Rotary worktable is used for marking.
Specification:
No. | Machine model | UV-3C |
1 | Laser wavelength | 355nm |
2 | Laser power | 3W / 20KHz |
3 | Repetition frequency | 10-200KHz |
4 | Marking range | 100mm*100mm |
5 | Marking line width | ≤0.01mm |
6 | Marking depth | ≤0.01mm |
7 | Min. character | 0.06mm |
8 | Marking linear speed | ≤7000mm/s |
9 | Repeatability | ±0.003mm |
10 | Power supply requirement | 220V/single-phase/50Hz/15A |
11 | Total power | ≤1KW |
12 | Main machine system dimension | 845x950x1630mm |
13 | Cooling system dimension | 485x580x270mm |
Sample