1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
Features：
1. With cold laser processing and small heat-affected zone, it can achieve high quality processing.
2. Wide applicable materials range can compensate for the shortage of infrared laser processing ability.
3. With good beam quality and small focusing spot, it can achieve superfine marking.
4. High marking speed, high efficiency, and high precision.
5. No consumables, low cost and low maintenance fee.
6. The overall machine has stable performance, supporting long-term operation.
2. Wide applicable materials range can compensate for the shortage of infrared laser processing ability.
3. With good beam quality and small focusing spot, it can achieve superfine marking.
4. High marking speed, high efficiency, and high precision.
5. No consumables, low cost and low maintenance fee.
6. The overall machine has stable performance, supporting long-term operation.
Specifications:
| Machine model | EP-15/25/30-THG-S |
| Laser wavelength | 355nm |
| Laser power | 4W / 7W / 10W /15W / 25W |
| Min. marking line width | 10µm-15µm |
| Marking speed | 250 characters/sec |
| Marking scope | 100*100mm |
| Standard lens | F160 |
| Pulse repetition frequency | 10-200kHz |
| Cooling mode | Water cooling |
| Power supply | AC 220V, 50Hz, 16A |
| Total power consumption | ≤1.5kW |
| Overall dimension | 800mm*950mm*1630mm |
Sample
Marking sample
Marking sample
Marking sample
Marking sample
Marking sample
Marking sample
Marking sample
Marking sample
Marking sample
Marking sample
