1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics.
2. LCD, OLED screen cutting (C, R, U angle cutting).
3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks.
Features：
1. Good beam quality, small spot size for ultra-fine marking.
2. The heat affected zone is small, avoiding damage to the processed material and high yield.
3. Marking speed, high efficiency, high precision.
4. No consumables, low cost of use and maintenance.
5. The machine performance is stable, long-term operation.
2. The heat affected zone is small, avoiding damage to the processed material and high yield.
3. Marking speed, high efficiency, high precision.
4. No consumables, low cost of use and maintenance.
5. The machine performance is stable, long-term operation.
Specifications:
| Machine model | EP-IRPS-20 |
| Laser wavelength | 1064nm |
| Laser power | 20W / 10ps / 1000kHz |
| Repeated frequency | 1000KHz |
| Marking scope | 100*100mm |
| Marking line width | ≤0.03mm |
| Marking depth | ≤0.1mm |
| Min. character | 0.06mm |
| Marking speed | ≤7000mm/s |
| Repeated accuracy | ±0.01mm |
| [pwer supply | AC 220V, 50Hz, 16A |
| Total power consumption | ≤1.5kW |
Sample
Mobile screen cutting
Ceramic cover cutting
Sapphire camera lens cutting
Medical instrument QR code marking
Metal watch plate characters marking
Material processing surface roughness
