Applicable products:：
Such as SMD LED, display LED, lamp LED, smart card IC, COB, power LED etc
Features:
Product parameters:
- Single monitor operation mode for real time operation status monitor and easier operation;
- Dual vision positioning system, improve die bonding accuracy;
- Sending 2 leadframes at the same time for two magazines, to reduce loading time;
- Universal jig, applicable to various products.
Product parameters:
| Die Bonding Speed | 180ms/cycle |
| Die Bonding Position Precision | ±1.5mil(±38μm) |
| Bonding Force | 20-200g |
| Maximum Stroke of Wafer Platform | 8” x 8” (203mm x 203mm) |
| Worktable Stroke | 5.5” x 16” (406mm x 140mm) |
| Wafer Size | 4x6"/1x8"wafer ring(optional) |
| Applicable chip | 5-80mil |
| Servo Driver | 100W/200W |
| Vision System | Digital image pattern recognition 0.5~4.5 continuous variable camera |
| Capacity | UPH up to 20K/h |
| Power supply | 220VAC/50-60HZ |
| Maximum power consumption | 1200W |
| Air supply | 5Kg/cm,69L/min |
| Dimension(WxDxH) | 1050mm x 1150mm x 2000mm |
| Weight | 710Kg |
Sample
