HANS-H583

Features:

• Suitable for IC products with leadframe width of ≤83mm;
• High-speed IC models under the new generation platform and architecture, higher UPH and stability;
• Accuracy of force control and USG output improved, reduces the possibility of craters and peeling;
• It has adaptive temperature control system to effectively improve the bonding accuracy;
• Equipped with a dual-frequency transducer and a lightweight piezo wire clamp, it has a wider range of product adaptability;
• Intelligent Power control system, effectively control energy consumption, more cost-effective;
• The new line arc algorithm can adapt to more materials and meet the requirements of complex products;
• Equipped with dual-path lens that can be adapted to multi-layer chipset products.

Product advantages:

• Higher UPH and stability;
• Accuracy of force control and USG output improved;
• Adapt to a variety of IC products;
• Effectively control energy consumption, more cost-effective.