Applicable products:：
Flash Memory、PLCC、BGA、QFP、SOP、DFN、QFN、DIP、SIP、TO、SOT and other mid-to-high-end IC products.
Features
- Support max 100mm leadframe;
- Equipped with dual frequency ultrasonic transducer, greatly improving product adaptability;
- Piezo-ceramic lightweight wire clamp, no need to correct the wire clamp gap to accommodate the switching of various wire;
- Fully automatic temperature adaptive system, improve bonding precision;
- Fuily intelligent and high sensitivity Bond Stick Detect system,more convenient;
- Independently research and development HMC operation and control system, improve force control accuracy and stability;
- New ultra high speed XY platform, fast, stable, and gas saving;
- Equipped with dual-path lens that can be adapted to multi-layer chipset products.
Product advantages:
- Support ultra-wide leadframe;
- Adapt to more diverse IC products;
- Micron-level bonding accuracy, strictly in line with the bonding requirements of IC products;
- Good stability and low maintenance costs.
Product parameters:
| Bonding Parameters | Bonding Accuracy | 士2μm@3σ |
| Bonding speed | 40ms@2mm WL | |
| Wire Diameter | 15-50uμm | |
| XY Table | Max Bonding Area | X:56mm Y:90mm |
| XY Resolution | 50nm | |
| Applicable Leadframe | Length | 95-300mm |
| Width | 22-100mm | |
| Thickness | 0.07-2.0mm (≥1.0mm need customize) |
|
| Specification | Weight | ≈740Kg |
| Dimension | 1080mm x 960mm x 1960mm |
Sample
