PV Glass Laser Drilling Machine
Brief Description
With the rise of photovoltaic double-glass modules, the demand for drilled back glass is increasing,
Categories
PV Industry
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Application
With the rise of photovoltaic double-glass modules, the demand for drilled back glass is increasing, and the drilling quality has become a key process link affecting the production of back glass. In response to the low-cost drilling requirements of thin glass, Han's Photovoltaic Equipment has developed high-precision, high-efficiency precision laser drilling equipment.
Main Features
With the rise of photovoltaic double-glass modules, the demand for drilled back glass is increasing, and the drilling quality has become a key process link affecting the production of back glass. In response to the low-cost drilling requirements of thin glass, Han's Photovoltaic Equipment has developed high-precision, high-efficiency precision laser drilling equipment.
Main Features
- Compatible with mainstream glass specifications (600*1200~1200*2500mm, thickness 1.6-5mm);
- The equipment includes acceleration section, rotation section, laser drilling section, rotation section and deceleration section;
- Compatible with long-side feeding (shingled type) and short-side feeding (conventional);
- The processing cycle is as fast as 6 pieces/min (diameter 12mm, thickness 2mm);
- Using highly stable laser, the process effect is stable.
Main Parameters
| Glass size | Min: 600×1200mm Max: 1200×2500mm Thickness: 1.6-5mm |
| The number of laser cutting heads for a single machine | not less than 3 |
| Machinable maximum hole diameter | 30mm |
| The hole diameter tolerance | within the range of ±0.2mm |
| The position of the holes that can be machined | can be punched at any position within the half-width range, middle or tail holes. |
| Minimum center-to-center distance of machinable holes | When drilling 3 holes at the same time, the minimum center-to-center distance of adjacent holes≥200mm |
| Machining hole position accuracy | within ±0.3mm |
| Laser power | ≥60W |
| Hole Appearance Requirements | The size of the chipping edge ≤ 0.3mm, No visible burrs and cracks are allowed, no cracks or bursts after tempering No burrs and cracks, no cracks or bursts after tempering |
| Speed adjustment method S | ervo speed adjustment |
| Cycle time | Processing φ12mm hole, 2.5±0.2mm embossing, no less than 5 pieces/min; 2.0±0.2mm, no less than 6 pieces/min |
| Machine size | 17000mm╳3800mm╳2700mm |
| equipment weight | 4500Kg |
Sample
Laser in
glass drilling
glass drilling
