Han's Laser CO2 laser drilling machine
Release time：2024.08.21
Views：1356The Han’s Laser CO2 laser drilling machine can be applied to the internal X+N+X ordinary HDI blind hole processing (subtractive process) of products in fields such as 5G communication, industrial control, automotive intelligence, and consumer electronics.
With the further increase in product assembly density and high-frequency signal transmission, HDI (high-density interconnect) design is increasingly being adopted, including communication products (5G infrastructure and 5G smartphones), data centers, automotive electronics, medical, home entertainment, LED display screens, and other main boards. According to different HDI structures (X+N+X conventional HDI, arbitrary layer HDI, class carrier board SLP), there are different drilling equipment requirements. Han’s Laser CNC's laser drilling products comprehensively cover the processing needs of through holes, blind holes, and other types of holes.
This model is one of the early models in China to achieve localization of HDI blind hole manufacturing process equipment. The CO2 dual axis dual table laser drilling equipment adopts a dual laser control scheme. The equipment adopts a new generation of lasers and adjusted scanning mirrors, which significantly increases production capacity by 25% compared to the last generation; The processing aperture is around 50 μm, which meets the requirements of any layer of HDI and SLP carrier board products; Dual table and dual laser design reduces the need for a splitting system and ensures stable structure; Combining grey cast iron platform to achieve high-precision drilling; The unique laser design principle significantly improves the utilization efficiency of laser energy and greatly reduces the overall power consumption of the device. The comprehensive power consumption of the equipment is only 18KW, a 54% reduction in energy consumption compared to peers (saving almost 150,000 yuan in comprehensive operating costs annually).
With the further increase in product assembly density and high-frequency signal transmission, HDI (high-density interconnect) design is increasingly being adopted, including communication products (5G infrastructure and 5G smartphones), data centers, automotive electronics, medical, home entertainment, LED display screens, and other main boards. According to different HDI structures (X+N+X conventional HDI, arbitrary layer HDI, class carrier board SLP), there are different drilling equipment requirements. Han’s Laser CNC's laser drilling products comprehensively cover the processing needs of through holes, blind holes, and other types of holes.
This model is one of the early models in China to achieve localization of HDI blind hole manufacturing process equipment. The CO2 dual axis dual table laser drilling equipment adopts a dual laser control scheme. The equipment adopts a new generation of lasers and adjusted scanning mirrors, which significantly increases production capacity by 25% compared to the last generation; The processing aperture is around 50 μm, which meets the requirements of any layer of HDI and SLP carrier board products; Dual table and dual laser design reduces the need for a splitting system and ensures stable structure; Combining grey cast iron platform to achieve high-precision drilling; The unique laser design principle significantly improves the utilization efficiency of laser energy and greatly reduces the overall power consumption of the device. The comprehensive power consumption of the equipment is only 18KW, a 54% reduction in energy consumption compared to peers (saving almost 150,000 yuan in comprehensive operating costs annually).
