Composition of laser solder paste and LED solid solder paste
Release time：2023.08.04
Views：1219Composition of laser solder paste and LED solid solder paste:
1. Solder paste is composed of solder alloy powder (hereinafter referred to as tin powder) and solder paste after stirring, while solder paste is composed of solvents, film-forming substances, activators, and thixotropic agents, etc
2. The specific gravity of tin powder in solder paste is usually between 85% and 92%
3. The proportion and composition of solder paste components to the mass of solder paste:
a. Film forming substance: 2% -5%, mainly composed of rosin and derivatives, synthetic materials, the most commonly used being water white rosin. b. Activator: 5% -0.5%, the most commonly used activator includes dicarboxylic acid, special carboxylic acid, and organic halide salt. c. Thixotropic agent: 6% -2%, which increases viscosity and plays a suspension role. There are many other substances like this.
Components of laser solder paste and LED solid solder paste:
1. Activator: This component mainly plays a role in removing oxidizing substances from the surface of PCB copper film solder pads and parts welding areas, while also reducing the surface tension of tin and lead;
2. Thixotropic: This component mainly regulates the viscosity and printing performance of solder paste, playing a role in preventing tailing, adhesion, and other phenomena during printing;
3. Resin: This component mainly plays a role in increasing the adhesion of solder paste, and has the function of protecting and preventing PCB from re-oxidation after soldering; This component plays a crucial role in fixing the parts;
4. Solvent: This component is the solvent of the solder flux component, which plays a uniform role in the stirring process of the solder paste and has a certain impact on the lifespan of the solder paste;
1. Solder paste is composed of solder alloy powder (hereinafter referred to as tin powder) and solder paste after stirring, while solder paste is composed of solvents, film-forming substances, activators, and thixotropic agents, etc
2. The specific gravity of tin powder in solder paste is usually between 85% and 92%
3. The proportion and composition of solder paste components to the mass of solder paste:
a. Film forming substance: 2% -5%, mainly composed of rosin and derivatives, synthetic materials, the most commonly used being water white rosin. b. Activator: 5% -0.5%, the most commonly used activator includes dicarboxylic acid, special carboxylic acid, and organic halide salt. c. Thixotropic agent: 6% -2%, which increases viscosity and plays a suspension role. There are many other substances like this.
Components of laser solder paste and LED solid solder paste:
1. Activator: This component mainly plays a role in removing oxidizing substances from the surface of PCB copper film solder pads and parts welding areas, while also reducing the surface tension of tin and lead;
2. Thixotropic: This component mainly regulates the viscosity and printing performance of solder paste, playing a role in preventing tailing, adhesion, and other phenomena during printing;
3. Resin: This component mainly plays a role in increasing the adhesion of solder paste, and has the function of protecting and preventing PCB from re-oxidation after soldering; This component plays a crucial role in fixing the parts;
4. Solvent: This component is the solvent of the solder flux component, which plays a uniform role in the stirring process of the solder paste and has a certain impact on the lifespan of the solder paste;
