The application of ultraviolet laser in the processing of brittle materials is increasing
Release time：2021.11.05
Views：3271The application of ultraviolet laser in the processing of brittle materials is increasing
In the field of life and high-end manufacturing, a lot of non-metallic materials are used, such as soft materials, thermoplastic materials, thermal sensitive materials, ceramic materials,
semiconductor materials, glass and other brittle materials. If these materials are processed by laser, the requirements for beam properties, ablation degree and material damage control
are very strict, and they are often required to achieve ultra-fine processing, even micro nano level. Using common infrared lasers is often difficult to achieve the decent results, and
ultraviolet laser is a very suitable choice.
semiconductor materials, glass and other brittle materials. If these materials are processed by laser, the requirements for beam properties, ablation degree and material damage control
are very strict, and they are often required to achieve ultra-fine processing, even micro nano level. Using common infrared lasers is often difficult to achieve the decent results, and
ultraviolet laser is a very suitable choice.
Processing of common brittle materials by UV laser
Glass is a material widely used in life. From water cup, wine cup, container to glass jewelry, pattern making on glass is often a difficult problem. Traditional processing often leads to
high glass damage rate. UV laser is very suitable for marking and pattern making on glass surface, and can realize ultra-fine production.
UV laser wafer cutting: the surface of sapphire substrate is hard, and it is difficult to cut it by general cutter wheel, with large wear, low yield and more than 30 cutting tracks μ m. It not
only reduces the use area, but also reduces the output of products. UV laser cutting wafer can achieve high-precision cutting, smooth incision and greatly improve the yield.
high glass damage rate. UV laser is very suitable for marking and pattern making on glass surface, and can realize ultra-fine production.
UV laser wafer cutting: the surface of sapphire substrate is hard, and it is difficult to cut it by general cutter wheel, with large wear, low yield and more than 30 cutting tracks μ m. It not
only reduces the use area, but also reduces the output of products. UV laser cutting wafer can achieve high-precision cutting, smooth incision and greatly improve the yield.
