Press release
09
2024,07
Popularization of Laser Knowledge by Han’s Laser: Femtosecond Laser and Sub-nanosecond Laser
Laser technology is considered as one of the the Four Great Inventions in the 20th century, which is in parallel with atomic energy, semiconductor and computer. Laser technology has been widely applied in the manufacturing industry, especially in important industries of the national economy such as automobiles, electronics
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18
2024,06
Advantages and disadvantages of handheld laser welding machine
Handheld laser welding machine is an efficient welding equipment that can complete a large amount of welding works in a very short time. This is mainly because laser welding is a non-contact welding technology that can complete welding work without direct contact with the surface of the workpiece.
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07
2024,06
The introduction of crystal engraving technology
Crystal laser engraving is a crystal processing technique that uses a laser machine to inject a certain wavelength (usually 532nm green laser) into the interior of a crystal, causing specific parts of the crystal to undergo subtle explosions and form bubbles, thereby outlining a preset shape. It also refers to crystal handicrafts processed using this technique.
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30
2024,05
Streamline Production with Han's Laser Marking Solutions, Ink-Free Precision
Han's Laser, a publicly traded company, is a leading name in the laser industry. As the number one laser solution provider in the Asia-Pacific region and ranked second globally, we achieved a sales revenue of $1.94 billion USD in 2023. Our commitment to innovation, stability, and longevity sets us apart, providing unmatched standards in the market.
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23
2024,05
The advantages of laser cutting over water cutting
Laser speed has advantages.
The speed of water cutting is slower than the laser cutting, especially in mass production, where speed becomes a serious limiting factor.
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16
2024,05
Application of Laser Technology in Semiconductor Wafer Slicing Process
Slicing is the process of dividing a semiconductor wafer into individual chips, usually carried out after the wafer has completed the previous process and electrical performance testing. As the first step in semiconductor packaging, the quality of slicing will directly affect the final reliability of the packaged product.
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