Products Plasma Cleaning Machine Plasma Cleaning Machine
HPC-Vacuum

Vacuum Plasma Cleaning Machine

HPC-Vacuum

Machine Features

1. Efficient Cleaning for metal surfaces

2. Effective Surface Modification for the subsequent processes such as dispensing, bonding, adhesion, welding, coating, and encapsulation

3. The chamber capacity and number of layers can be customized according to customer requirements to meet specific needs.

Applications

Suitable for the printed circuit board (PCB) industry, semiconductor and IC fields, silicone, plastic, and polymer sectors, as well as the automotive, 3C electronics, and aerospace industries.

Brief Description

Main Applications of Plasma Cleaning Equipment:
1. Adhesion Enhancement: Improves the reliability and durability of surface bonding.
2. Activation: Significantly increases surface wettability, creating an active surface.
3. Surface Modification: Enhances subsequent processes such as dispensing, bonding, adhesion, welding, coating, and encapsulation.
4. Cleaning: Removes organic contaminants, oxides, and trace oil residues from metal surfaces.

Cleaning Effects

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