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1. Efficient Cleaning for metal surfaces
2. Effective Surface Modification for the subsequent processes such as dispensing, bonding, adhesion, welding, coating, and encapsulation
3. The chamber capacity and number of layers can be customized according to customer requirements to meet specific needs.
Suitable for the printed circuit board (PCB) industry, semiconductor and IC fields, silicone, plastic, and polymer sectors, as well as the automotive, 3C electronics, and aerospace industries.