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Picosecond Laser Marking Machine

Machine Features

1. Good beam quality, small spot size for ultra-fine marking

2. small heat affected zone avoiding damage to the processed material

3. High marking speed, high efficiency, high precision

4. No consumables, low operation and maintenance costs

5. Stable and long-term operation

Applications

1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics. 2. LCD, OLED screen cutting (C, R, U angle cutting). 3. Ultra-precise marking on the glass material for the fine invisible QR codes (0.2mm) and other fine marks.

Technical Data Sheet

Machine Model	EP-IRPS-20
Laser Wavelength	1064nm
Laser Power	20W / 10ps / 1000kHz
Repeated Frequency	1000KHz
Marking Scope	100*100mm
Marking Line Width	≤0.03mm
Marking Depth	≤0.1mm
Minimum Character Size	0.06mm
Marking Speed	≤7000mm/s
Repeated Accuracy	±0.01mm
Supply Voltage, Power Demand	AC 220V, 50Hz, 16A
Total Power Consumption	≤1.5kW

Laser Marking Effects

Mobile screen cutting

Ceramic cover cutting

Sapphire camera lens cutting

Medical instrument QR code marking

Metal watch plate characters marking

Material processing surface roughness

Sales Hotline

+86-400-666-4000