Products Laser Marking Equipment Picosecond Laser Marking Machine

Picosecond Laser Marking Machine

Machine Features

1. Good beam quality, small spot size for ultra-fine marking

2. small heat affected zone avoiding damage to the processed material

3. High marking speed, high efficiency, high precision

4. No consumables, low operation and maintenance costs

5. Stable and long-term operation

Applications

1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics. 2. LCD, OLED screen cutting (C, R, U angle cutting). 3. Ultra-precise marking on the glass material for the fine invisible QR codes (0.2mm) and other fine marks.

Technical Data Sheet

Machine Model

EP-IRPS-20

Laser Wavelength

1064nm

Laser Power

20W / 10ps / 1000kHz

Repeated Frequency

1000KHz

Marking Scope

100*100mm

Marking Line Width

≤0.03mm

Marking Depth

≤0.1mm

Minimum Character Size

0.06mm

Marking Speed

≤7000mm/s

Repeated Accuracy

±0.01mm

Supply Voltage, Power Demand

AC 220V, 50Hz, 16A

Total Power Consumption

≤1.5kW


Laser Marking Effects

Mobile screen cutting
Mobile screen cutting
Ceramic cover cutting
Ceramic cover cutting
Sapphire camera lens cutting
Sapphire camera lens cutting
Medical instrument QR code marking
Medical instrument QR code marking
Metal watch plate characters marking
Metal watch plate characters marking
Material processing surface roughness
Material processing surface roughness
Contact Us
Sales Hotline
+86-400-666-4000