UV Nanosecond Laser

Machine Features

1. Adjustable repetition frequency

2. Modular design

3. TEM00 mode output

4. High average power, up to 30W

Applications

Featuring ultra-small heat-affected zone from exclusive cold processing technology, this machine achieves ultra-fine machining and microstructure fabrication on non-metallic brittle materials in high-end manufacturing. It is widely used in 3C sector and key mobile phone production processes. Its total shipments surpass 15,000 units, ranking top in market share of equivalent lasers.

Application Scope:

1. Marking, depaneling, cutting and drilling of PCB & FPC

2. Micro-hole and blind-hole machining of silicon wafers

3. Solar cell processing

4. Silicon wafer scribing

5. Ceramic scribing, cutting and drilling

6. Ink and PVD coating removal

7. Material surface marking

Technical Data Sheet

Machine Model	HL-NS-355-5/10/15	HL-NS-355-20
Laser Characteristics
Wavelength	355nm
Power	5W/10W/15W	20W
Repetition Frequency	10-200 kHz	60-400khz
Pulse Width	10-100ns	20-100ns
Pulse Stability	<3%rms,1σ	<3%rms,1σ
Beam Characteristics
Spatial Mode	TEM00
M2	<1.3
Degree Of Polarization	100:1 Horizontal
Spot Diameter	1.1 mm ±0.1mm	1.4mm ±0.2mm
Full Divergence Angle	<2 mrad
Spot Symmetry	>90%
Beam Directivity	<± 25 µrad/°C
Operating Conditions
Supply Voltage	100-240V,50 -60Hz
Warm-Up Time	Standby to ready:<10 mins; Cold start to ready:<30 mins
Temperature Range	Operating: 18~35°C; Non-operating: 0~50°C
Humidity	10–90%, non-condensing
Cooling Method	Water cooling; Chiller accuracy: ±0.1°C; Minimum flow rate: 6L/min
Total Power Consumption	<1000 W
Physical Characteristics
Laser Head Dimensions (L × W × H)	500mm×230.5mm×132mm
Laser Head Weight	18kg
Controller Dimensions (L × W × H)	477 mm× 440mm × 177mm
Controller Weight	21kg

Sales Hotline

+86-400-666-4000