Applicable products:：
Wedge bonderf developed for TO discrete devices, power devices, photovoltaic devices, IPM and other scenarios.
Features:
Product advantages:
Product parameters:
- Double bond head design greatly improves the production efficiency;
- Support 5-20mil aluminum wire;
- Supports capillaries, cutters, and consumables that are common in the market;
- Self-developed high-speed recognition algorithm;
- Newly designed high-speed and high-stiffness motion platform;
- Independent research and development of high-performance multi-axis linkage servo motion control system;
- New operation control and milligram-level force control system, faster response and stability;
- Fast, real-time, accurate and high-precision post-bond inspection;
- The new structural design greatly simplifies the maintenance time and cost of the equipment.
Product advantages:
- Double bond head，high production efficiency;
- Milligram-level force control system, faster response;
- High-stiffness motion platform;
- Good stability and low maintenance costs.
Product parameters:
| Bonding Parameters | XYZ Axis Accuracy | Revolution 0.05μm |
| XYZ Axis Stroke | 79mm x 100mm x 50mm | |
| Theta Axis Accuracy | Revolution 0.0057° | |
| Theta Axis Stroke | ±220° | |
| Material Handling System | Material Handling Mechanism | Fully Automatic Feeding and Discharging |
| Applicable Leadframe | Length | 100-280mm |
| Width | 18-80mm | |
| Thickness | ≤3mm | |
| Specification | Weight | ≈1000Kg |
| Dimension | 1970mm x 1130mm x 2490mm |
Sample
