HANS-H582
HANS-H582

HANS-H582

Brief Description
Applicable products::
1010、2121、1515、2835、3020、3528、5050、7070、3014、0603 and other full categories of LED products
Categories Wire bonder
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Features:
  • UPH has been comprehensively improved, based on the newly designed high-speed and high-stiffness XY platform, bringing the ultimate experience of fast, accurate and stable;
  • The ultra-fast arc mode developed for the LED Industry, supports various complex arc types, and debugging is simple and fast;
  • Equipped with a new high-speed recognition algorithm, the recognition efficiency and recognition speed are 30% higher than that of the previous generation;
  • Mature process support for small electrode LED and high-and LED products;
  • Brand new EFO function design, multi-stage high precision output in EFO stage;
  • Fast, real-time, accurate and high-precision post bond inspection(PBI);
  • Brand new structure design, greatly simplifies the maintenance and lower the cost, improves customers on site efficiency;
  • It has adaptive temperature control system to effectively improve the bonding accuracy.
           
Product advantages:
  • The fastest LED wire bonder in China;
  • The LED product process is mature;
  • High bonding precision;
  • Good stability and low maintenance costs.
         
Product parameters:
Bonding Parameters Bonding Accuracy 2μm@3σ
Bonding speed 40ms@2mm WL
Wire Diameter 15-50uμm
XY Table Max Bonding Area X:56mm  Y:75mm
XY Resolution 50nm
Applicable Leadframe Length 95-275mm
Width 22-78mm
Thickness 0.07-2.0mm
(≥1.0mm need customize)
Specification Weight 600Kg
Dimension 940mm x 890mm x 1960mm
Sample
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